Cluster tool demands on oxidation process for device fabrication leads to requirement of single wafer high pressure hot process tool. A joint development project between GaSonics/IPC and Texas Instruments has produced a working tool capable of delivering high quality oxides and excellent reflow performance to meet the future needs of the industry.
Charles A. Boitnott,
David R. Craven,
"Single-wafer high-pressure oxidation", Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); doi: 10.1117/12.56622; http://dx.doi.org/10.1117/12.56622