Laser-induced metal deposition and laser cutting techniques for fixing IC design errors

David C. Shaver; Scott P. Doran; Mordechai Rothschild; Jan H. C. Sedlacek

doi:10.1117/12.51010

1 December 1991 Laser-induced metal deposition and laser cutting techniques for fixing IC design errors

David C. Shaver, Scott P. Doran, Mordechai Rothschild, Jan H. C. Sedlacek

Proceedings Volume 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI; (1991) https://doi.org/10.1117/12.51010
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States

Abstract

The local modification of an integrated circuit (IC) requires in general the availability of three generic processes. First, a method for cutting conductors must be provided. Second, a process for depositing new conductors must be available. Finally, a means of opening via holes through the chip passivation to the underlying conductors is needed; this operation enables newly deposited conductors to make connections to the existing circuit elements, and also provides probe access to facilitate testing of the circuit.

Citation Download Citation

David C. Shaver, Scott P. Doran, Mordechai Rothschild, and Jan H. C. Sedlacek "Laser-induced metal deposition and laser cutting techniques for fixing IC design errors", Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); https://doi.org/10.1117/12.51010

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