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1 December 1991 Laser-induced metal deposition and laser cutting techniques for fixing IC design errors
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Proceedings Volume 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI; (1991) https://doi.org/10.1117/12.51010
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
The local modification of an integrated circuit (IC) requires in general the availability of three generic processes. First, a method for cutting conductors must be provided. Second, a process for depositing new conductors must be available. Finally, a means of opening via holes through the chip passivation to the underlying conductors is needed; this operation enables newly deposited conductors to make connections to the existing circuit elements, and also provides probe access to facilitate testing of the circuit.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David C. Shaver, Scott P. Doran, Mordechai Rothschild, and Jan H. C. Sedlacek "Laser-induced metal deposition and laser cutting techniques for fixing IC design errors", Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); https://doi.org/10.1117/12.51010
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