Unframed via interconnection of nonplanar device structures

Manjin J. Kim

doi:10.1117/12.51007

1 December 1991 Unframed via interconnection of nonplanar device structures

Manjin J. Kim

Proceedings Volume 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI; (1991) https://doi.org/10.1117/12.51007
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States

Abstract

Multilevel metallization is an indispensable requirement for dense VLSI or ULSI because each additional level can significantly reduce the chip size. Multi-device integration is another trend for higher on-chip performance in which many different device structures, including non-planar trench structures, are fabricated from different material.

Citation Download Citation

Manjin J. Kim "Unframed via interconnection of nonplanar device structures", Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); https://doi.org/10.1117/12.51007

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