Laser-formed structures to facilitate TAB bonding

Peter G. Ledermann; Glen W. Johnson; Mark B. Ritter

doi:10.1117/12.51037

1 December 1991 Laser-formed structures to facilitate TAB bonding

Peter G. Ledermann, Glen W. Johnson, Mark B. Ritter

Proceedings Volume 1598, Lasers in Microelectronic Manufacturing; (1991) https://doi.org/10.1117/12.51037
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States

Abstract

A laser heating process was used to form structures which facilitate tape automated bonding (TAB). Uniform metal spheroids were created by melting the end of each TAB conductor intended for connection to the terminal pads of an integrated circuit (IC). A fully automated laser tool designed and built to fabricate these structures is described. Results for ICs bonded using this technology are presented.

Citation Download Citation

Peter G. Ledermann, Glen W. Johnson, and Mark B. Ritter "Laser-formed structures to facilitate TAB bonding", Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); https://doi.org/10.1117/12.51037

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