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1 December 1991 Laser process for personalization and repair of multichip modules
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Proceedings Volume 1598, Lasers in Microelectronic Manufacturing; (1991) https://doi.org/10.1117/12.51034
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
A process for fast personalization of multi-chip modules has been developed. Multilayer substrates with an incomplete top layer are prefabricated. Substrates are personalized within a few hours, using a frequency doubled Nd:YAG laser. 50 ns pulses with a pulse energy of 0.3 mJ are used for cutting. The same laser is also used for the direct writing of spot links, by decomposition of copper formate films with pulses of only 0.2 (mu) J at a repetition rate of 100 kHz. A detailed description of the applied copper formate technology is presented here.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Heinrich G. Mueller, Claire T. Galanakis, Scott C. Sommerfeldt, Tom J. Hirsch, and Robert F. Miracky "Laser process for personalization and repair of multichip modules", Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); https://doi.org/10.1117/12.51034
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