Paper
1 December 1991 Material influence on cutting and drilling of metals using copper vapor lasers
Roland Kupfer, Hans W. Bergmann, Marion Lingenauer
Author Affiliations +
Proceedings Volume 1598, Lasers in Microelectronic Manufacturing; (1991) https://doi.org/10.1117/12.51025
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
Up to now, copper vapor lasers (CVLs) have been mainly applied in the field of nuclear fuel enrichment, as illumination sources, in short time photography and in medical applications. Due to their interesting characteristics (short pulse duration, high repetition rate) these lasers might also become useful in the field of materials processing. In this paper recent investigations on the drilling behavior of different metals with a CVL are reported. Fine drilled holes in thin metal sheets with minimized heat affected zones could be obtained. Microscopical investigations were used to characterize the influence of different substrates and processing conditions.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Roland Kupfer, Hans W. Bergmann, and Marion Lingenauer "Material influence on cutting and drilling of metals using copper vapor lasers", Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); https://doi.org/10.1117/12.51025
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Cited by 4 scholarly publications.
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KEYWORDS
Laser drilling

Laser cutting

Microelectronics

Manufacturing

Copper

Laser manufacturing

Copper vapor lasers

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