Paper
1 January 1992 Reticle defect sizing and printability
Brian J. Grenon, Karen D. Badger, Michael J. Trybendis
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Abstract
As reticle defect specifications become more stringent and maximum allowable defect sizes approach the resolution of current defect inspection systems, the mask fabricator1s ability to accurately determine the size of these defects becomes limited. We have evaluated several techniques by which the size of reticle defects can be measured and have found significant discrepancies between techniques. Using a standard defect inspection system, we measured defects at or below 1.0 ^m and found that the results varied with each technique. Defects were sized using both reflected and transmitted light and the results were compared to SEM measurements. The reflected-light measurements best correlated with the SEM measurements, which are considered more accurate. The results of this study indicated that current sizing techniques are inaccurate. A printability evaluation was also performed using a mask with accurately sized defects. Defect printability results were evaluated in terms of their effect on linewidth.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Brian J. Grenon, Karen D. Badger, and Michael J. Trybendis "Reticle defect sizing and printability", Proc. SPIE 1604, 11th Annual BACUS Symposium on Photomask Technology, (1 January 1992); https://doi.org/10.1117/12.56943
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KEYWORDS
Photomasks

Scanning electron microscopy

Reticles

Semiconducting wafers

Inspection

Opacity

Mask making

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