1 May 1992 Efficiency of vaporization cutting by copper vapor laser
Author Affiliations +
Proceedings Volume 1628, Intense Laser Beams; (1992) https://doi.org/10.1117/12.59001
Event: OE/LASE '92, 1992, Los Angeles, CA, United States
The copper vapor laser (CVL) can be a very suitable tool for cutting and drilling with minimum roughness and maximum accuracy. Visible range of irradiation, perfect quality of output beam, high pulse power, and pulse repetition frequency favor this application. However, there is no data on productivity of cutting, which defines the economic benefit of using CVL technology. In the present paper, the cutting productivity is estimated on the basis of efficiency of material removal from the processing zone: the ratio of evaporated mass (multiplied by vaporization heat) to laser energy within the processing time. Aluminum specimens with 0.02 (mu) thickness (thin film) and 100 (mu) thickness (foil) are cut with different output power and cutting velocity. Use of specimens with these thicknesses allows the observation of two phenomena which define the cutting efficiency. One of them, evaporation from the free surface, is typical for thin (a few micron or less) materials. The second one, vapor flying and condensation, can only reduce initial efficiency when material thickness becomes more than cutwidth.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michail O. Nikonchuk, Michail O. Nikonchuk, Igor V. Polyakov, Igor V. Polyakov, } "Efficiency of vaporization cutting by copper vapor laser", Proc. SPIE 1628, Intense Laser Beams, (1 May 1992); doi: 10.1117/12.59001; https://doi.org/10.1117/12.59001


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