26 June 1992 Use of microchannel cooling for high-power two-dimensional laser diode arrays
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A significant challenge for achieving higher average power two-dimensional diode lasers lies in effectively removing the enormous heat flux generated by these devices. Packaging based on microchannel cooling offers a practical means of addressing the thermal management problem. Microchannel coolers are capable of extracting high heat fluxes ( > 60 Watts/cm2) while maintaining a highly uniform surface temperature. These coolers require less than 0.5 1pm coolant flow and operate with nearly constant thermal impedance over a range of 10 to 50 psig fluid pressure. State-of the -art performance of two-dimensional arrays mounted on microchannel plates confirm the thermal characteristics of the coolers. The thermal impedance of the entire package (cooling fluid to diode junction) is less than 0.33 °C.cm2/W. Arrays exceeding 1500 W peak power at duty cycle of 2% routinely exhibit less than 4 nm bandwidth with accurate control of center wavelength.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rushikesh M. Patel, Rushikesh M. Patel, David K. Wagner, David K. Wagner, Allen D. Danner, Allen D. Danner, Kambiz Fallahpour, Kambiz Fallahpour, Richard S. Stinnett, Richard S. Stinnett, } "Use of microchannel cooling for high-power two-dimensional laser diode arrays", Proc. SPIE 1634, Laser Diode Technology and Applications IV, (26 June 1992); doi: 10.1117/12.59178; https://doi.org/10.1117/12.59178

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