1 August 1992 Three-dimensional inspection of integrated circuits: a depth from focus approach
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Abstract
Optical inspection of integrated circuit images is an application of image understanding which is becoming an important field in the microelectronics industry. When the inspection is performed by optical microscopy, a small depth of field of an optical system causes problems dealing with focusing when structures with large depth variations are imaged. We propose a method which takes advantage of this effect to make a depth map of the circuit surface. The method is based on the analysis of defocusing on a series of images obtained by continuously varying the distance between the circuit surface and the center of the optical system. Morphological algorithms working in three-dimensional spaces are used to ensure the coherence of the results.
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Xavier Binefa, Xavier Binefa, Jordi M. Vitria, Jordi M. Vitria, Juan Jose Villanueva, Juan Jose Villanueva, } "Three-dimensional inspection of integrated circuits: a depth from focus approach", Proc. SPIE 1661, Machine Vision Applications in Character Recognition and Industrial Inspection, (1 August 1992); doi: 10.1117/12.130302; https://doi.org/10.1117/12.130302
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