9 July 1992 Finite element analysis of dynamic thermal distortions of an x-ray mask for synchrotron radiation lithography
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Abstract
This paper presents the transient modelling of an x-ray lithography mask undergoing continuous wave x-ray exposure. Two- and three-dimensional finite element models are developed to analyze the heat transfer mechanisms in the mask-wafer-holder assembly system. An additional structural model is used to calculate thermally-induced stresses and distortions (in-plane and out-of-plane) as a function of time. Parametric studies are performed to identify the effects of the Gaussian beam width, scanning frequency, exposure time and proximity gap setting on the dynamic response of the membrane.
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Eric A. Haytcher, Eric A. Haytcher, Roxann L. Engelstad, Roxann L. Engelstad, N. M. Schnurr, N. M. Schnurr, } "Finite element analysis of dynamic thermal distortions of an x-ray mask for synchrotron radiation lithography", Proc. SPIE 1671, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II, (9 July 1992); doi: 10.1117/12.136019; https://doi.org/10.1117/12.136019
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