1 June 1992 High-speed aqueous-developing negative resist based on triflic-acid-catalyzed epoxy polymerization
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The need for higher resolution is a continuing driving force in the development of new lithographic materials. In this paper we discuss a new high speed, high resolution negative photoresist based on acid catalyzed epoxy polymerization. These materials are copolymers of two monomers that each provide a separate function in the photoresist. This combination provides a unique new material with aqueous processability in metal ion-free developers and high sensitivity to photogenerated triflic acid. Imaging characteristics in electron beam and i- line exposure systems are discussed.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert D. Allen, Robert D. Allen, Will Conley, Will Conley, Jeffrey D. Gelorme, Jeffrey D. Gelorme, } "High-speed aqueous-developing negative resist based on triflic-acid-catalyzed epoxy polymerization", Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); doi: 10.1117/12.59745; https://doi.org/10.1117/12.59745

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