1 June 1992 Direct measurement of stepper mark detection accuracy on processed wafers
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Abstract
A novel method to evaluate the accuracy of the stepper alignment system on processed substrates has been developed. The technique allows one to measure directly, with a limited number of wafers and high accuracy, just the contribution of the alignment system inaccuracy to final overlay. Applications of the method are under evaluation, especially in the optimization of the alignment systems of steppers. Experimental procedures and algorithms are provided and some examples of experimental results are shown.
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Paolo Canestrari, Paolo Canestrari, Samuele Carrera, Samuele Carrera, Giovanni Rivera, Giovanni Rivera, } "Direct measurement of stepper mark detection accuracy on processed wafers", Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59804; https://doi.org/10.1117/12.59804
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