1 June 1992 Elimination of send-ahead wafers in an IC fabrication line
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Abstract
The use of sendahead wafers to control a lithography sector severely limits the performance of that sector. As a result, the elimination of sendahead wafers is most desirable. Through the creation of a robust resist process, careful metrology and modeling of the jobs being processed, and through the use of statistical process control on key variables, we have achieved a Cp of .98 and a Cpk of .95 on an 800 nanometer linewidth, 200 nanometer overlay lithography technology. These results have been achieved on our 8 inch, GCA Autostep 200 2145 i-line steppers at the same time that sendahead wafers have been eliminated. This paper discusses the work done to stabilize the lithography sector and eliminate sendahead wafers, the introduction of statistical process control in that sector and the effects of that introduction on the quality of lots being processed. This paper also presents long term tool and process stability data.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexander Lee Martin, Louis Anastos, Christopher P. Ausschnitt, John Balas, Lionel Brige, Kevin M. Golden, David T. Long, James T. Marsh, Roger H. Taylor, Alan C. Thomas, "Elimination of send-ahead wafers in an IC fabrication line", Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59840; https://doi.org/10.1117/12.59840
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