1 June 1992 Evaluation of "bag-in-bottle" resist dispense system
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Abstract
Photoresist defectivity is a major source of yield loss in the manufacture of integrated circuits. Contamination may result from the resist, the resist process or coating track components. Much work has been carried out to reduce the causes of defects whilst maintaining the properties of the resist fi1m. Exposure of the resist to air is thought to result in solvent loss and moisture absorption which causes the information of gel slugs and dried resist flakes. These gel slugs and dried resist flakes form defects in the resist film. Traditional containment systems for resist such as glass bottles allow for high exposure to air. The irregular physical properties of resultant contaminants from air exposure may allow random passage through filtration systems and can then be incorporated within the film causing pattern defects to occur. Sealed "Bag-in-Bottle" (BIB) systems considerably reduce the exposure of the enclosed chemical to the environment, and have been demonstrated to have an effect in controlling pattern defectivity as part of a total system improvement3. Potential advantages of such sealed systems include improved package cleanliness, reduced exposure of the resist to air during use and improved resist utilization. This investigation involves a comparison between standard glass bottle and BIB containment for undyed and dyed resists. The analysis techniques used were short loop defectivity monitors, laser scanning of resist-coated wafers and defectivity analysis on actual device at wafer probe yield check. Chemical analysis of ionic contaminants and total resist utilization were also measured for both containment systems.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Heather C. Prutton, Heather C. Prutton, Samuel Geraint Evans, Samuel Geraint Evans, } "Evaluation of "bag-in-bottle" resist dispense system", Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59835; https://doi.org/10.1117/12.59835
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