PROCEEDINGS VOLUME 1674
MICROLITHOGRAPHY '92 | 8-12 MARCH 1992
Optical/Laser Microlithography V
Editor(s): John D. Cuthbert
IN THIS VOLUME

1 Sessions, 69 Papers, 0 Presentations
temporary  (69)
MICROLITHOGRAPHY '92
8-12 March 1992
San Jose, CA, United States
temporary
Proc. SPIE 1674, Computer-aided design tool for phase-shifting masks, 0000 (1 June 1992); doi: 10.1117/12.130307
Proc. SPIE 1674, Systematic design of phase-shifting masks with extended depth of focus and/or shifted focus plane, 0000 (1 June 1992); doi: 10.1117/12.130308
Proc. SPIE 1674, Conjugate twin-shifter masks with multiple focal planes, 0000 (1 June 1992); doi: 10.1117/12.130309
Proc. SPIE 1674, Computer-aided optimal design of phase-shifting masks, 0000 (1 June 1992); doi: 10.1117/12.130310
Proc. SPIE 1674, Exploring the limits of phase-shift lithography: Part I--the alternating shifter, 0000 (1 June 1992); doi: 10.1117/12.130311
Proc. SPIE 1674, Subhalf-micron lithography system with phase-shifting effect, 0000 (1 June 1992); doi: 10.1117/12.130312
Proc. SPIE 1674, Advanced i-line resist performance with and without phase-shift masks, 0000 (1 June 1992); doi: 10.1117/12.130313
Proc. SPIE 1674, Effect of condenser tilt on projection images produced by a phase-shifting mask, 0000 (1 June 1992); doi: 10.1117/12.130314
Proc. SPIE 1674, Characterization and performance of advanced i-line photoresists for 0.5-micron CMOS technology, 0000 (1 June 1992); doi: 10.1117/12.130315
Proc. SPIE 1674, Reduction of linewidth variation over reflective topography, 0000 (1 June 1992); doi: 10.1117/12.130316
Proc. SPIE 1674, New process technology for CD control in deep-submicron optical lithography, 0000 (1 June 1992); doi: 10.1117/12.130317
Proc. SPIE 1674, Process solutions for the global proximity effect on submicron lithography, 0000 (1 June 1992); doi: 10.1117/12.130318
Proc. SPIE 1674, Two-dimensional high-resolution stepper image monitor, 0000 (1 June 1992); doi: 10.1117/12.130319
Proc. SPIE 1674, Polarization effects in mask transmission, 0000 (1 June 1992); doi: 10.1117/12.130320
Proc. SPIE 1674, Improving stepper alignment capability through phase-shifting techniques, 0000 (1 June 1992); doi: 10.1117/12.130321
Proc. SPIE 1674, Primary processes in e-beam and laser lithographies for phase-shift mask manufacturing, 0000 (1 June 1992); doi: 10.1117/12.130322
Proc. SPIE 1674, Novel process for phase-shifting mask fabrication, 0000 (1 June 1992); doi: 10.1117/12.130323
Proc. SPIE 1674, Fabrication and evaluation of chromium/phase-shifter/quartz structure phase-shift mask, 0000 (1 June 1992); doi: 10.1117/12.130324
Proc. SPIE 1674, Optimization of positive novolak-based resists for phase-shift mask technology, 0000 (1 June 1992); doi: 10.1117/12.130325
Proc. SPIE 1674, Phase and transmission error study for the alternating-element (Levenson) phase-shifting mask, 0000 (1 June 1992); doi: 10.1117/12.130326
Proc. SPIE 1674, Understanding focus effects in submicron optical lithography: Part 3--methods for depth-of-focus improvement, 0000 (1 June 1992); doi: 10.1117/12.130327
Proc. SPIE 1674, Using multiple focal planes to enhance depth of focus, 0000 (1 June 1992); doi: 10.1117/12.130328
Proc. SPIE 1674, Efficient numerical simulation of high-NA i-line lithography processes, 0000 (1 June 1992); doi: 10.1117/12.130329
Proc. SPIE 1674, Effect of chromatic aberration in excimer laser lithography, 0000 (1 June 1992); doi: 10.1117/12.130330
Proc. SPIE 1674, Deep-UV lithography for prototype 64-megabit DRAM fabrication, 0000 (1 June 1992); doi: 10.1117/12.130331
Proc. SPIE 1674, Fundamental differences between positive- and negative-tone imaging, 0000 (1 June 1992); doi: 10.1117/12.130332
Proc. SPIE 1674, Strategies for deep-UV patterning of half-micron contacts using negative photoresists, 0000 (1 June 1992); doi: 10.1117/12.130333
Proc. SPIE 1674, New antireflective layer for deep-UV lithography, 0000 (1 June 1992); doi: 10.1117/12.130334
Proc. SPIE 1674, Novel ARC optimization methodology for KrF excimer laser lithography at low K1 factor, 0000 (1 June 1992); doi: 10.1117/12.130335
Proc. SPIE 1674, Polarization studies with broadband deep-UV lithography, 0000 (1 June 1992); doi: 10.1117/12.130336
Proc. SPIE 1674, Modeling spray/puddle dissolution processes for DUV acid-hardened resists, 0000 (1 June 1992); doi: 10.1117/12.130337
Proc. SPIE 1674, Chromeless phase mask by resist silylation, 0000 (1 June 1992); doi: 10.1117/12.130338
Proc. SPIE 1674, New method of topography simulation in photolithography, 0000 (1 June 1992); doi: 10.1117/12.130339
Proc. SPIE 1674, High-performance wafer stage: simplification delivers performance, 0000 (1 June 1992); doi: 10.1117/12.130340
Proc. SPIE 1674, Characterization of mask fabrication for submicron geometries using a shaped vector electron-beam system, 0000 (1 June 1992); doi: 10.1117/12.130341
Proc. SPIE 1674, Trend and limitation of process using the simulation and experimental method for phase-shift mask, 0000 (1 June 1992); doi: 10.1117/12.130342
Proc. SPIE 1674, Advanced krypton fluoride excimer laser for microlithography, 0000 (1 June 1992); doi: 10.1117/12.130343
Proc. SPIE 1674, I-line, DUV, VUV, or x ray?, 0000 (1 June 1992); doi: 10.1117/12.130344
Proc. SPIE 1674, Wavelength tuning for optimization of deep-UV excimer laser performance, 0000 (1 June 1992); doi: 10.1117/12.130345
Proc. SPIE 1674, Alignment technique using wafer rear surface, 0000 (1 June 1992); doi: 10.1117/12.130346
Proc. SPIE 1674, Lithographic impact of thin film effects on advanced BIMOS semiconductor device layer structures, 0000 (1 June 1992); doi: 10.1117/12.130347
Proc. SPIE 1674, Practicing the top antireflector process, 0000 (1 June 1992); doi: 10.1117/12.130348
Proc. SPIE 1674, Narrow band KrF excimer laser for mass production of ULSI ICs, 0000 (1 June 1992); doi: 10.1117/12.130349
Proc. SPIE 1674, Shape effects of edge-line phase shifter on light intensity contrast, 0000 (1 June 1992); doi: 10.1117/12.130350
Proc. SPIE 1674, Color centers photomasks produced by electron-beam lithography, 0000 (1 June 1992); doi: 10.1117/12.130351
Proc. SPIE 1674, Intermix technology: the key to optimal stepper productivity and cost efficiency, 0000 (1 June 1992); doi: 10.1117/12.130352
Proc. SPIE 1674, Planarization of spin-coated films, 0000 (1 June 1992); doi: 10.1117/12.130353
Proc. SPIE 1674, Gradient phase-shifter transitions fabricated by ion milling, 0000 (1 June 1992); doi: 10.1117/12.130354
Proc. SPIE 1674, In-process image detection technique for determination of overlay and image quality for ASM-L wafer stepper, 0000 (1 June 1992); doi: 10.1117/12.130355
Proc. SPIE 1674, Lithographic alternatives to PSM repair, 0000 (1 June 1992); doi: 10.1117/12.130356
Proc. SPIE 1674, Laser-induced damage in pellicles at 193 nm, 0000 (1 June 1992); doi: 10.1117/12.130357
Proc. SPIE 1674, Novel laser microlithography system, 0000 (1 June 1992); doi: 10.1117/12.130358
Proc. SPIE 1674, Novel 0.2-um i-line lithography using phase-shifting on the substrate, 0000 (1 June 1992); doi: 10.1117/12.130359
Proc. SPIE 1674, Modeling of optical images in resists by vector potentials, 0000 (1 June 1992); doi: 10.1117/12.130360
Proc. SPIE 1674, Some problems in 1:1 broadband excimer laser lithography, 0000 (1 June 1992); doi: 10.1117/12.130361