Paper
1 September 1992 High-performance 30 TDI scan reversible MWIR InSb hybrid scanning array with on-focal-plane dynamic-range compression
Timothy F. Henricks, Thomas E. Wilson, D. Renee Bishop, James Halvis, Robert R. Shiskowski
Author Affiliations +
Abstract
This paper details a high performance MWIR scanning array with 30 time delay and integration stages (TDI), forward and reverse scan operation, less than 80 noise electrons per stage, and on focal plane blooming control and dynamic range compression. The 92 column by 30 TDI device is fabricated using hybrid technology with the detector fabricated in InSb and indium bumped to a VLSI/CMOS/CCD silicon readout fabricated in 1.25 micrometers CMOS with two poly and three metal interconnect levels.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Timothy F. Henricks, Thomas E. Wilson, D. Renee Bishop, James Halvis, and Robert R. Shiskowski "High-performance 30 TDI scan reversible MWIR InSb hybrid scanning array with on-focal-plane dynamic-range compression", Proc. SPIE 1685, Infrared Detectors and Focal Plane Arrays II, (1 September 1992); https://doi.org/10.1117/12.137807
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KEYWORDS
Charge-coupled devices

Metals

Staring arrays

Transistors

Sensors

Amplifiers

Infrared detectors

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