13 January 1993 Hybrid integration of surface-emitting microlaser chip and planar optics substrate
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A one-dimensional array of surface-emitting microlasers was bonded onto a glass substrate that contains a matching array of microlenses and mirrors. The bonding was achieved by solder bump bonding with indium being used as the solder material. The alignment precision is within +/- 2 micrometers. The optical substrate provides a simple interconnection scheme that routes the light from each laser to a well defined output position. The lenses are implemented as diffractive elements and are fabricated by lithography and dry etching.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Juergen Jahns, Juergen Jahns, Robert A. Morgan, Robert A. Morgan, Hung N. Nguyen, Hung N. Nguyen, James A. Walker, James A. Walker, Susan J. Walker, Susan J. Walker, Yiu-May Wong, Yiu-May Wong, } "Hybrid integration of surface-emitting microlaser chip and planar optics substrate", Proc. SPIE 1751, Miniature and Micro-Optics: Fabrication and System Applications II, (13 January 1993); doi: 10.1117/12.138903; https://doi.org/10.1117/12.138903

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