13 January 1993 Hybrid integration of surface-emitting microlaser chip and planar optics substrate
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Abstract
A one-dimensional array of surface-emitting microlasers was bonded onto a glass substrate that contains a matching array of microlenses and mirrors. The bonding was achieved by solder bump bonding with indium being used as the solder material. The alignment precision is within +/- 2 micrometers. The optical substrate provides a simple interconnection scheme that routes the light from each laser to a well defined output position. The lenses are implemented as diffractive elements and are fabricated by lithography and dry etching.
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Juergen Jahns, Juergen Jahns, Robert A. Morgan, Robert A. Morgan, Hung N. Nguyen, Hung N. Nguyen, James A. Walker, James A. Walker, Susan J. Walker, Susan J. Walker, Yiu-May Wong, Yiu-May Wong, } "Hybrid integration of surface-emitting microlaser chip and planar optics substrate", Proc. SPIE 1751, Miniature and Micro-Optics: Fabrication and System Applications II, (13 January 1993); doi: 10.1117/12.138903; https://doi.org/10.1117/12.138903
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