Continued demands for higher performance and safer vehicles mandate use of new technologies for development of automotive structures. These structures are not only mechanical in nature, but also involve electronics. Durability of automotive electronics depends on their response to environmental and other loads that they encounter. Typically this response is characterized by force-displacement characteristics. Since displacements in electronic components are small, their determination is difficult. In this paper, analytical and empirical methodologies for determination of displacements of electronic components are outlined. It is shown that, using heterodyne hologram interferometry, displacements of electronic components can be measured on the scale of nanometers.