Compact 3D wafer packaging using waveguide holographic optical elements

Cong T. Nguyen; Freddie Shing-Hong Lin; Michael R. Wang

doi:10.1117/12.983215

2 February 1993 Compact 3D wafer packaging using waveguide holographic optical elements

Cong T. Nguyen, Freddie Shing-Hong Lin, Michael R. Wang

Proceedings Volume 1773, Photonics for Computers, Neural Networks, and Memories; (1993) https://doi.org/10.1117/12.983215
Event: San Diego '92, 1992, San Diego, CA, United States

Abstract

A waveguide holographic optical interconnect technique is used for signal distribution operations in a compact 3D wafer packaging configuration. This paper describes the design, fabrication and results of an integrated optical device which utilizes this waveguide holographic optical interconnect technique.

Citation Download Citation

Cong T. Nguyen, Freddie Shing-Hong Lin, and Michael R. Wang "Compact 3D wafer packaging using waveguide holographic optical elements", Proc. SPIE 1773, Photonics for Computers, Neural Networks, and Memories, (2 February 1993); https://doi.org/10.1117/12.983215

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