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14 January 1993 Organic electro-optic devices for optical interconnection
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Abstract
The exceptional electro-optic properties of poled polymer films, coupled with the power and flexibility of thin film fabrication and photolithographic processing, may make possible the hybrid integration of electronic and photonic devices, combining the processing power of VLSI with a dense, high bandwidth, photonic interconnection and switching network in a single, large format, package. In this paper, we describe the potential applications and benefits of electro-optic polymers for optical interconnection and present a review of some of the relevant progress to date in electro-optic polymer materials and devices. Development of an all-polyimide electro-optic polymer system (cladding/core/cladding) based entirely on commercially available components is described. An integrated optic Mach-Zehnder modulator was fabricated using this material system and used in a 200 Mbit/sec digital signal transmission optical interconnection demonstration. Lastly, a potential increase in electro-optic polymer integration density was illustrated by a proof of concept demonstration of three levels of waveguide structures on a single substrate.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
George F. Lipscomb, Richard S. Lytel, Susan P. Ermer, John Francis Valley, Timothy E. Van Eck, Dexter G. Girton, and Anthony J. Ticknor "Organic electro-optic devices for optical interconnection", Proc. SPIE 1774, Nonconducting Photopolymers and Applications, (14 January 1993); https://doi.org/10.1117/12.139188
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