1 August 1992 Reactive ion etching of deep trenches in silicon
Author Affiliations +
We have developed a new production technology of deep trenches RIE with a photoresist mask. RIE was performed in a low-pressure batch diode reactor. Wafers were placed on RF (5,28 MHz) electrode covered by organic lacquer. The maximum loading was 24 wafers having a diameter of 100 mm. Positive photoresist with 2 micron thickness was used for masking without any thermal treatment after development. The line width was 1.5 - 2.0 micron. Because earlier investigated mixtures of chlorine and bromine-containing halocarbons with SF6 didn't allow sufficient selectivity silicon/photoresist, we have proposed to use for deep silicon etching the mixture of CF3I/SF6 and investigated the dependence of silicon and photoresist etch rates and etch anisotropy on basic controlled plasma parameters.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vladimir N. Bliznetsov, Oleg P. Gutshin, V. Yachmenev, "Reactive ion etching of deep trenches in silicon", Proc. SPIE 1783, International Conference of Microelectronics: Microelectronics '92, (1 August 1992); doi: 10.1117/12.130992; https://doi.org/10.1117/12.130992

Back to Top