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Improving built-in product reliability through the efficient identification of nonrandom contamination events
Lifetest IC failures due to metal extrusion and migration resulting from process-induced stress relief
Example of the "upstream approach" methodology: an investigation of open-contact failures in ASIC devices
Use of the charge-induced voltage alteration technique to analyze precursors to dielectric breakdown
Maximization of nMOSFET hot-carrier injection stability through optimization of device and process design
Current gain degradation of boron-doped polysilicon emitter transistors under forward current stress in a C-BiCMOS technology
Hot-carrier effects in thin-film, p-channel, hydrogen-passivated polysilicon-on-insulator LDD MOSFETs