Example of the `upstream approach` methodology: an investigation of open-contact failures in ASIC devices

Tam T. Le; R. R. Mitchell; Jen-Jiang J. Lee; C. E. Chen; Hoang Huy Hoang

doi:10.1117/12.139341

14 January 1993 Example of the "upstream approach" methodology: an investigation of open-contact failures in ASIC devices

Tam T. Le, R. R. Mitchell, Jen-Jiang J. Lee, C. E. Chen, Hoang Huy Hoang

Author Affiliations +

Proceedings Volume 1802, Microelectronics Manufacturing and Reliability; (1993) https://doi.org/10.1117/12.139341
Event: Microelectronic Processing '92, 1992, San Jose, CA, United States

Abstract

As the VLSI/ULSI device density is increasing, the number of interconnects also increases at a much larger scale. Consequently, more interconnect related failures are expectedly threatening the quality and reliability of the devices. However, with an appropriate methodology, manufacturing defects can be removed from the source, thus preventing any latent field failures. This approach requires a total teamwork between various engineering groups: failure analysis, test/product engineering, manufacturing, etc. The purpose of this paper is to demonstrate a proven success of the 'Upstream Approach': A direct and effective methodology in preventing process-induced failures.

Citation Download Citation

Tam T. Le, R. R. Mitchell, Jen-Jiang J. Lee, C. E. Chen, and Hoang Huy Hoang "Example of the "upstream approach" methodology: an investigation of open-contact failures in ASIC devices", Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); https://doi.org/10.1117/12.139341

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