Translator Disclaimer
14 January 1993 Example of the "upstream approach" methodology: an investigation of open-contact failures in ASIC devices
Author Affiliations +
Proceedings Volume 1802, Microelectronics Manufacturing and Reliability; (1993) https://doi.org/10.1117/12.139341
Event: Microelectronic Processing '92, 1992, San Jose, CA, United States
Abstract
As the VLSI/ULSI device density is increasing, the number of interconnects also increases at a much larger scale. Consequently, more interconnect related failures are expectedly threatening the quality and reliability of the devices. However, with an appropriate methodology, manufacturing defects can be removed from the source, thus preventing any latent field failures. This approach requires a total teamwork between various engineering groups: failure analysis, test/product engineering, manufacturing, etc. The purpose of this paper is to demonstrate a proven success of the 'Upstream Approach': A direct and effective methodology in preventing process-induced failures.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tam T. Le, R. R. Mitchell, Jen-Jiang J. Lee, C. E. Chen, and Hoang Huy Hoang "Example of the "upstream approach" methodology: an investigation of open-contact failures in ASIC devices", Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); https://doi.org/10.1117/12.139341
PROCEEDINGS
5 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Application of RTA to a 0.8-um BiCMOS process
Proceedings of SPIE (February 15 1994)
Wafer level reliability
Proceedings of SPIE (January 14 1993)
Bad vias are the cause for electrical test yield losses...
Proceedings of SPIE (August 28 1998)

Back to Top