14 January 1993 Example of the "upstream approach" methodology: an investigation of open-contact failures in ASIC devices
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Proceedings Volume 1802, Microelectronics Manufacturing and Reliability; (1993) https://doi.org/10.1117/12.139341
Event: Microelectronic Processing '92, 1992, San Jose, CA, United States
Abstract
As the VLSI/ULSI device density is increasing, the number of interconnects also increases at a much larger scale. Consequently, more interconnect related failures are expectedly threatening the quality and reliability of the devices. However, with an appropriate methodology, manufacturing defects can be removed from the source, thus preventing any latent field failures. This approach requires a total teamwork between various engineering groups: failure analysis, test/product engineering, manufacturing, etc. The purpose of this paper is to demonstrate a proven success of the 'Upstream Approach': A direct and effective methodology in preventing process-induced failures.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tam T. Le, Tam T. Le, R. R. Mitchell, R. R. Mitchell, Jen-Jiang J. Lee, Jen-Jiang J. Lee, C. E. Chen, C. E. Chen, Hoang Huy Hoang, Hoang Huy Hoang, } "Example of the "upstream approach" methodology: an investigation of open-contact failures in ASIC devices", Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); doi: 10.1117/12.139341; https://doi.org/10.1117/12.139341
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