For deep submicron device manufacturing, Rapid Thermal Processing (RTP) tools will play a major role. Current RTP tools have not been fully integrated into manufacturing. The most important problem is the product wafer temperature control. Data obtained on implant activation, titanium silicidation and oxidation processes will be reviewed to present the capability of current tools. Temperature control requirements for deep submicron device manufacturing will be discussed. Process performance of current RTP tools fall far short of the requirements.