21 May 1993 Interpretation of current-induced noise for detection of ULSI/VLSI interconnection reliability problems
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Abstract
This paper summarizes several different types of current induced (excess) noise time domain waveforms and the power spectra behavior associated with specific ULSI/VLSI interconnection problems. Importance of maintaining waveform stationarity when using 1/f2 noise to detect electromigration is illustrated. In addition, non-stationary waveforms, associated with thin films with high degrees of stress are reported. A discussion of large magnitude 1/f spectra associated with the presence of film voids, poor step coverage and/or wire bonding problems is presented.
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James G. Cottle, "Interpretation of current-induced noise for detection of ULSI/VLSI interconnection reliability problems", Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145452; https://doi.org/10.1117/12.145452
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