26 March 1993 Defect reduction methodologies: pellicle yield improvement
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The pelliclization process at Intel during the first half of 1991 was not in control. Weekly process yield was trending downward, and the range of the weekly yield during that time frame was greater than 40%. A focused effort in process yield improvement, that started in the second half of 1991 and continued through 1992, brought process yield up an average of 20%, and reduced the range of the process yield to 20 - 25%. This paper discusses the continuous process improvement guidelines that are being followed to reduce variations/defects in the pelliclization process. Teamwork tools, such as Pareto charts, fishbone diagrams, and simple experiments, prioritize efforts and help find the root cause of the defects. Best known methods (BKM), monitors, PMs, and excursion control aid in the elimination and prevention of defects. Monitoring progress and repeating the whole procedure are the final two guidelines. The benefits from the use of the continuous process improvement guidelines and tools can be seen in examples of the actions, impacts, and results for the last half of 1991 and the first half of 1992.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Susan V. Daugherty, Susan V. Daugherty, } "Defect reduction methodologies: pellicle yield improvement", Proc. SPIE 1809, 12th Annual BACUS Symposium on Photomask Technology and Management, (26 March 1993); doi: 10.1117/12.142133; https://doi.org/10.1117/12.142133


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