Paper
4 May 1993 Micromachining with excimer lasers: photoablation and plasma spluttering
B. Wolff-Rottke, H. Schmidt, A. Scholl, Juergen Ihlemann
Author Affiliations +
Proceedings Volume 1810, 9th International Symposium on Gas Flow and Chemical Lasers; (1993) https://doi.org/10.1117/12.144570
Event: Ninth International Symposium on Gas Flow and Chemical Lasers, 1992, Heraklion, Greece
Abstract
Different materials like polymers, glasses, and ceramics have been machined by photoablation with excimer laser radiation (193 nm, 248 nm, 308 nm). Structuring with micrometer resolution can be achieved for these materials if the right wavelength, fluence, and pulse repetition rate is chosen. At high fluence or intensity the ablation process seems to be superimposed by some kind of plasma sputtering. The diameter of deep holes becomes significantly larger than the spot diameter on the sample surface. On the bottom of the holes a regular microstructure appears for several materials. The development of this structure depends on the fluence and the ambient atmosphere.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. Wolff-Rottke, H. Schmidt, A. Scholl, and Juergen Ihlemann "Micromachining with excimer lasers: photoablation and plasma spluttering", Proc. SPIE 1810, 9th International Symposium on Gas Flow and Chemical Lasers, (4 May 1993); https://doi.org/10.1117/12.144570
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KEYWORDS
Laser ablation

Laser drilling

Polymers

Excimer lasers

Plasma

Positron emission tomography

Glasses

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