Pad analysis system: a successful machine vision application for solder ball inspection

Rainer Richter; Kathryn Barr Kirtley

doi:10.1117/12.132079

1 November 1992 Pad analysis system: a successful machine vision application for solder ball inspection

Rainer Richter; Kathryn Barr Kirtley;

Author Affiliations +

Proceedings Volume 1823, Machine Vision Applications, Architectures, and Systems Integration; (1992) https://doi.org/10.1117/12.132079
Event: Applications in Optical Science and Engineering, 1992, Boston, MA, United States

Abstract

The pad analysis system (PAS) is an automated visual inspection system developed through a joint effort of the research and manufacturing divisions. It inspects wafers for low volume solder balls. Solder balls (also called pads or bumps) are used to join semiconductor chips to substrates. When low volume solder balls fail to join, there is a resulting open circuit defect. PAS is a cost effective method of providing customers with a high quality level. The solder ball manufacturing process, while providing excellent quality, is not capable of producing the levels needed by the sophisticated chips and modules used in mainframes. PAS also provides a benefit by increasing yield. Its increased accuracy reduces the overkill associated with manual inspection. PAS is also programmed with pad functionality information about which non- critical low volume pads can be safely shipped. This information is typically too complex to be implemented manually. PAS significantly reduces rework, generates labor savings, and even improves yield. The PAS is an example of both a productive collaboration and a successful technology transfer between research and manufacturing. It is also the story of incremental improvements in hardware, software, and function which allowed the system to inspect increasingly complex chips with decreased cycle time and reduced operator intervention.

Citation Download Citation

Rainer Richter, Kathryn Barr Kirtley, "Pad analysis system: a successful machine vision application for solder ball inspection", Proc. SPIE 1823, Machine Vision Applications, Architectures, and Systems Integration, (1 November 1992); doi: 10.1117/12.132079; https://doi.org/10.1117/12.132079

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