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19 April 1993 Profile characteristics of excimer laser micromachined features
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Proceedings Volume 1835, Excimer Lasers: Applications, Beam Delivery Systems, and Laser Design; (1993) https://doi.org/10.1117/12.143039
Event: Applications in Optical Science and Engineering, 1992, Boston, MA, United States
Abstract
In our work with excimer lasers, we observe a complex depth profile in processed blind holes that is energy, material, and process independent. This feature occurs when processing ceramics, polyimide, semiconductors, and metals. Further it occurs under different optical configurations. An understanding of this phenomena is essential when micron-precision features are required. We present our findings and explore explanations.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Martin D. Tabat, Terence R. O'Keeffe, and Wen Ho "Profile characteristics of excimer laser micromachined features", Proc. SPIE 1835, Excimer Lasers: Applications, Beam Delivery Systems, and Laser Design, (19 April 1993); https://doi.org/10.1117/12.143039
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