Compression-molded polymer-based optical bus

Ray T. Chen; Suning Tang; Gajendra D. Savant; Tomasz P. Jannson

doi:10.1117/12.147080

1 July 1993 Compression-molded polymer-based optical bus

Ray T. Chen, Suning Tang, Gajendra D. Savant, Tomasz P. Jannson

Proceedings Volume 1849, Optoelectronic Interconnects; (1993) https://doi.org/10.1117/12.147080
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States

Abstract

In this paper, we report an optical bus fabrication technology using compression-molding technique. The linear dimension of such a waveguide is well beyond that of a microlithographically defined waveguide. The interconnection patterns such as fan-ins and fan- outs can be easily defined by the mold plunger. The resolution of compression molding can be as high as 2 micrometers . Therefore, optical bus density as high as approximately 10⁴ channels/cm is producible while the linear dimension of the waveguide can be much larger than that made through conventional microlithography. Employment of optically transparent electronic packaging polymers (OTEPPs) as the system buses automatically provides process compatibility with silicon IC fabrication. All the polymer microstructure waveguide materials are either thermosets or thermoplastics. Both can be molded to a specific shape as desired.

Citation Download Citation

Ray T. Chen, Suning Tang, Gajendra D. Savant, and Tomasz P. Jannson "Compression-molded polymer-based optical bus", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); https://doi.org/10.1117/12.147080

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