1 July 1993 Multi-fiber/chip coupling and optoelectronic integrated circuit packaging based on flip-chip bonding techniques
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Proceedings Volume 1849, Optoelectronic Interconnects; (1993) https://doi.org/10.1117/12.147089
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
For the packaging of integrated InP devices we present two approaches, which rely on a passive fiber alignment. In one case the fibers are hold in V-grooves etched directly into the InP, alternatively, V-grooves are etched into Si and the InP chip is assembled by a self- aligning flip chip process.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rolf Weber, F. Fidorra, Michael Hamacher, Helmut Heidrich, and G. Jacumeit "Multi-fiber/chip coupling and optoelectronic integrated circuit packaging based on flip-chip bonding techniques", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147089; https://doi.org/10.1117/12.147089
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