1 July 1993 Packaged reconfigurable space-variant optical interconnect using wavelength multiplexed volume holograms
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Proceedings Volume 1849, Optoelectronic Interconnects; (1993) https://doi.org/10.1117/12.147085
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
The packaging opto-electronic interconnects has the potential to create compact, highly dense communication networks. We present a packaged space-variant optical interconnect module using wavelength multiplexed volume holographic elements recorded in photorefractive materials. The input/output arrays (4 X 4), an illumination lenslet array, and a set of two wavelength multiplexed off-axis volume holographic lenslet arrays were integrated with a series of several glass substrates to form a free-space optical interconnect. The size of the packaged optical interconnect module was 40 mm X 24 mm X 37 mm. Reconfigurable interconnection was demonstrated on the packaged module by performing the perfect shuffle and butterfly networks, at different wavelengths. Several packaging issues, such as alignment, bonding, energy efficiency, and system scalability were studied.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jian Ma, Jian Ma, Brian E. Catanzaro, Brian E. Catanzaro, Walter Daeschner, Walter Daeschner, Yeshaiahu Fainman, Yeshaiahu Fainman, Sing H. Lee, Sing H. Lee, } "Packaged reconfigurable space-variant optical interconnect using wavelength multiplexed volume holograms", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147085; https://doi.org/10.1117/12.147085


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