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1 July 1993 Progress and status of guided-wave optical interconnection technology
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Proceedings Volume 1849, Optoelectronic Interconnects; (1993)
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Optical interconnects at the cabinet-to-cabinet, board-to-board, and multichip module-to- multichip module levels will enable future avionics systems requirements to be met by eliminating undesirable compromises associated with electrical interconnects. Fiber optics is the well established medium of choice for cabinet-to-cabinet applications, while planar polymeric interconnects are required at the backplane level. Significant advances have been made in demonstrating practical polymer interconnects compatible with existing board fabrication principles, however both waveguide loss and interfaces to optoelectronic components require further improvement before the technology is broadly applicable.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Julian P. G. Bristow, Charles T. Sullivan, Sayan D. Mukherjee, Yue Liu, and Anis Husain "Progress and status of guided-wave optical interconnection technology", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993);

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