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24 June 1993 Direct contact-type image sensor unit
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Proceedings Volume 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices; (1993) https://doi.org/10.1117/12.147594
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
A new type of flip-chip mounting method and a new type of optical plate have been developed. In addition, a new type of multi-chip direct contact-type image sensor has been developed, using the above mounting method and optical plate, for graphic image scanners used in office equipment such as high-speed facsimiles, intelligent photo-copy equipment, and computers. Furthermore, a next-generation multi-chip direct contact-type image sensor is now being developed.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tetsuroh Nakamura, Eiichiroh Tanaka, and Shinji Fujiwara "Direct contact-type image sensor unit", Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); https://doi.org/10.1117/12.147594
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