24 June 1993 Micro-optic and microelectronic integrated packaging of vertical-cavity lasers
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Proceedings Volume 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices; (1993) https://doi.org/10.1117/12.147590
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
The applications for optoelectronic integrated circuits demand high performance optoelectronic devices or smart pixels. The stringent requirements on these smart pixels require that packaging technology be developed concurrently to the development of the optoelectronic components. We discuss the packaging requirements of smart pixels based on vertical-cavity microlasers. We present a novel microlens/macrolens combination which allows high power densities to be focused to a diffraction-limited spot using present VCSEL technology. Finally, we discuss the applications for microlaser-based spatial light source arrays.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Greg R. Olbright, Greg R. Olbright, Jack L. Jewell, Jack L. Jewell, Robert P. Bryan, Robert P. Bryan, Winston S. Fu, Winston S. Fu, "Micro-optic and microelectronic integrated packaging of vertical-cavity lasers", Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); doi: 10.1117/12.147590; https://doi.org/10.1117/12.147590
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