24 June 1993 Packaging of optical interconnect arrays for optical signal processing and computing
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Proceedings Volume 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices; (1993) https://doi.org/10.1117/12.147588
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
There are many requirements for computer interconnects and local loop telecommunications for parallel fiber optic data channels. There have recently been many packaging approaches where a few channels have been cleverly packaged, using self-aligned approaches with silicon photolithographically etched rectangular or V-groove channels to achieve accurate alignment. Practical economical packaging of arrays must be developed, using conventional electronic packages for the interfacing optoelectronic arrays to fiber ribbon cables. In this way, optoelectronic arrays may be introduced which are compatible with conventional electronic packaging, and therefore readily acceptable to present system integrator and manufacturers. Depending on the application, single mode or multi-mode interconnects may be required. This paper proposes approaches to achieve both single mode and multi-mode array packaging which may be interfaced directly to existing electronic systems.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael Kevin Kilcoyne, Michael Kevin Kilcoyne, Jeff W. Scott, Jeff W. Scott, John J. Plombon, John J. Plombon, } "Packaging of optical interconnect arrays for optical signal processing and computing", Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); doi: 10.1117/12.147588; https://doi.org/10.1117/12.147588
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