24 June 1993 Si-based laser subassembly for telecommunications
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Proceedings Volume 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices; (1993) https://doi.org/10.1117/12.147599
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
Silicon is used as a packaging medium to integrate a laser, lenses, and a back facet monitor into a compact sub-assembly suitable for low-cost laser packages. The sub-assembly consists of separate laser and detector/optics submounts made of silicon. Only a single axis alignment is required during assembly to align the lenses (300 micrometers diameter sapphire spheres) with the laser active area. In a single lens configuration, the integrated sub-assembly had 25% coupling efficiency into single-mode fiber compared to 30% maximum coupling efficiency achieved on the optical bench. Coupling efficiencies of the integrated sub-assembly to 50 micrometers multi-mode fiber greater than 70% were achieved. The effective numerical aperture of the back facet monitor in the sub-assembly was greater than 0.7.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. Michael MacDonald, R. E. Fanucci, Greg E. Blonder, "Si-based laser subassembly for telecommunications", Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); doi: 10.1117/12.147599; https://doi.org/10.1117/12.147599
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