24 June 1993 Si-based laser subassembly for telecommunications
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Proceedings Volume 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices; (1993) https://doi.org/10.1117/12.147599
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Silicon is used as a packaging medium to integrate a laser, lenses, and a back facet monitor into a compact sub-assembly suitable for low-cost laser packages. The sub-assembly consists of separate laser and detector/optics submounts made of silicon. Only a single axis alignment is required during assembly to align the lenses (300 micrometers diameter sapphire spheres) with the laser active area. In a single lens configuration, the integrated sub-assembly had 25% coupling efficiency into single-mode fiber compared to 30% maximum coupling efficiency achieved on the optical bench. Coupling efficiencies of the integrated sub-assembly to 50 micrometers multi-mode fiber greater than 70% were achieved. The effective numerical aperture of the back facet monitor in the sub-assembly was greater than 0.7.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. Michael MacDonald, W. Michael MacDonald, R. E. Fanucci, R. E. Fanucci, Greg E. Blonder, Greg E. Blonder, } "Si-based laser subassembly for telecommunications", Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); doi: 10.1117/12.147599; https://doi.org/10.1117/12.147599

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