Excimer laser as a source for thin Cu film deposition for use in electronic device fabrication

Alvin Sugerman; Bodil Braren; Frank Turene; W. Wajda

doi:10.1117/12.147624

24 June 1993 Excimer laser as a source for thin Cu film deposition for use in electronic device fabrication

Alvin Sugerman, Bodil Braren, Frank Turene, W. Wajda

Proceedings Volume 1856, Laser Radiation Photophysics; (1993) https://doi.org/10.1117/12.147624
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States

Abstract

Investigations are carried out to characterize Cu deposition from a solid target using a XeCl, 28 ns pulse width, excimer laser at energies between 2 - 15 J/cm². Scanning electron microscope (SEM) studies of the target surface revealed sputtering effects, droplet formation and surface waves. Density per unit substrate area of droplet-like-Cu particles transferred from the target is a function of frequency, deposition time, state of the target surface and power density. Mass and charge collected at the substrate are obtained as a function of distance to the target. Mass deposition as a variation of laser beam to target angle, facetting angle at feature edges and grain size as a function of substrate bias were measured. Fill shape evolution of micron size holes are obtained. An energy threshold for Cu-ion generation is extrapolated from the measured ion current vs. energy in.

Citation Download Citation

Alvin Sugerman, Bodil Braren, Frank Turene, and W. Wajda "Excimer laser as a source for thin Cu film deposition for use in electronic device fabrication", Proc. SPIE 1856, Laser Radiation Photophysics, (24 June 1993); https://doi.org/10.1117/12.147624

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