24 June 1993 Improving wire-bond quality on multichip modules through reduction of polyimide ablation debris
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Proceedings Volume 1856, Laser Radiation Photophysics; (1993) https://doi.org/10.1117/12.147612
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
Ablation of polyimide with a XeCl excimer laser produces deposits of soot-like debris that can alter the surface properties of adjacent structures. In this case, debris accumulation degraded the quality of ultrasonic wire bonding to contaminated bond pads. The addition of flowing helium during the ablation process visibly reduced the debris accumulation and improved subsequent wire bonding. The quality of wire bonding was then used to measure the relative importance of ablation process parameters in the reduction of debris.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daniel G. Patterson, Daniel G. Patterson, Michael Doscher, Michael Doscher, Robert Gephard, Robert Gephard, "Improving wire-bond quality on multichip modules through reduction of polyimide ablation debris", Proc. SPIE 1856, Laser Radiation Photophysics, (24 June 1993); doi: 10.1117/12.147612; https://doi.org/10.1117/12.147612
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