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Soft x-ray (14 nm) lithography with ultrathin imaging layers and selective electroless metallization
Fabrication of x-ray masks with 0.15-um level two-dimensional patterns by using highly accurate FIB lithography
Characteristics of the spherical pinch plasma radiation source (SPX II) for x-ray, UV, and deep-UV lithography
What is required for collimated point-source x-ray lithography to achieve an economically viable throughput?
Effects of absorber topography and multilayer coating defects on reflective masks for soft x-ray/EUV projection lithography
Achieving superior MEBES performance through the use of SPC programs and state-of-the-art facilities