15 September 1993 Influence of residual casting solvent on the dissolution behavior of diazonaphthoquinone resists
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Abstract
Residual casting solvent present in resist films can have a profound effect on their dissolution behavior. We have used a radiolabeling technique to make quantitative measurements of solvent remaining in spin cast films after they have undergone different baking protocols. Films of poly (3-methyl-4-hydroxystyrene) were found to contain a significant fraction of propylene glycol methyl ether acetate (as much as 50% by weight) depending on the baking conditions. Films that were 1000 angstroms thick contained a higher percentage of residual solvent than films that were 1 micrometers . The solvent concentration in films containing a mixture of polymer and photoactive compound was a maximum for films containing 5 wt% PAC.
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Veena Rao, Veena Rao, William D. Hinsberg, William D. Hinsberg, Curtis W. Frank, Curtis W. Frank, Roger Fabian W. Pease, Roger Fabian W. Pease, } "Influence of residual casting solvent on the dissolution behavior of diazonaphthoquinone resists", Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154789; https://doi.org/10.1117/12.154789
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