Thermal properties of state of the art novolak-diazonaphtoquinone systems: differences between bulk and film properties

Patrick Jean Paniez; Jean-Paul E. Chollet; Michel J. Pons

doi:10.1117/12.154797

15 September 1993 Thermal properties of state of the art novolak-diazonaphtoquinone systems: differences between bulk and film properties

Patrick Jean Paniez, Jean-Paul E. Chollet, Michel J. Pons

Author Affiliations +

Proceedings Volume 1925, Advances in Resist Technology and Processing X; (1993) https://doi.org/10.1117/12.154797
Event: SPIE'S 1993 Symposium on Microlithography, 1993, San Jose, CA, United States

Abstract

As demonstrated by both thermal analysis (DSC) and thermal flow experiments, the latest resists for advanced i-line lithography exhibit improved thermal properties. Emphasis is placed upon experimental details to obtain reliable and meaningful data. In addition to the results of these experiments, the high glass transition temperatures (T_g) measured, equal or superior to the recommended soft-bake conditions, raise new questions concerning the formation and properties of the resist film. The T_g of the film is shown to be different from that of the bulk material and to depend on the bake conditions. The DSC results are confirmed by thermal flow experiments and a good correlation is obtained between the two methods. The consequences induced by the use of high T_g materials on other steps in the lithographic process, namely standing wave reduction and plasma durability, are also discussed.

Citation Download Citation

Patrick Jean Paniez, Jean-Paul E. Chollet, and Michel J. Pons "Thermal properties of state of the art novolak-diazonaphtoquinone systems: differences between bulk and film properties", Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); https://doi.org/10.1117/12.154797

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