Translator Disclaimer
15 September 1993 Thermal properties of state of the art novolak-diazonaphtoquinone systems: differences between bulk and film properties
Author Affiliations +
Abstract
As demonstrated by both thermal analysis (DSC) and thermal flow experiments, the latest resists for advanced i-line lithography exhibit improved thermal properties. Emphasis is placed upon experimental details to obtain reliable and meaningful data. In addition to the results of these experiments, the high glass transition temperatures (Tg) measured, equal or superior to the recommended soft-bake conditions, raise new questions concerning the formation and properties of the resist film. The Tg of the film is shown to be different from that of the bulk material and to depend on the bake conditions. The DSC results are confirmed by thermal flow experiments and a good correlation is obtained between the two methods. The consequences induced by the use of high Tg materials on other steps in the lithographic process, namely standing wave reduction and plasma durability, are also discussed.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Patrick Jean Paniez, Jean-Paul E. Chollet, and Michel J. Pons "Thermal properties of state of the art novolak-diazonaphtoquinone systems: differences between bulk and film properties", Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); https://doi.org/10.1117/12.154797
PROCEEDINGS
12 PAGES


SHARE
Advertisement
Advertisement
Back to Top