Paper
4 August 1993 New feature extraction technique for detection of defects in microlithography patterns
Damayanti C. Gharpure, Sunil K. David
Author Affiliations +
Abstract
This paper presents a new feature extraction technique named the Bending Point Counting Method (BPCM) for detection of defects in microlithography patterns. Digitization leads to breaking up of continuous contours into line segments and adjoining bending points. The defects are detected by counting the number of bending points in a detector window having dimensions smaller than the minimum linewidth of the pattern. Due to applications of image processing techniques, the algorithm is able to cope with the image distortions and inaccuracies arising due to reproducibility of automatic setting of the inspection system. The paper deals with the principle and mathematical formulation of the algorithm. The experiments carried out to test the validity as well as versatility of the algorithm are discussed.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Damayanti C. Gharpure and Sunil K. David "New feature extraction technique for detection of defects in microlithography patterns", Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); https://doi.org/10.1117/12.149004
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KEYWORDS
Defect detection

Inspection

Sensors

Algorithm development

Feature extraction

Detection and tracking algorithms

Image segmentation

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