Survey on pattern dimension measurement

Toshio Kaneko; Yoshihiro Todokoro

doi:10.1117/12.148956

4 August 1993 Survey on pattern dimension measurement

Toshio Kaneko, Yoshihiro Todokoro

Proceedings Volume 1926, Integrated Circuit Metrology, Inspection, and Process Control VII; (1993) https://doi.org/10.1117/12.148956
Event: SPIE'S 1993 Symposium on Microlithography, 1993, San Jose, CA, United States

Abstract

We report here survey results on pattern dimension measurement of masks and wafers. The SEMI Standard Metrology Committee in Japan have carried out a survey from June to September in 1992. The target of this survey consists of semiconductor device makers, inspection equipment makers, material makers, and academic institutes. We have got replies for ten questions from 44 respondents, and found some interesting results. E(Electron)-beam and optical equipment are mainly used in the R&D and the mass production lines respectively. In appears that the e-beam equipment is gradually replacing the optical equipment as a tool to measure finer pattern dimensions, however the e-beam equipment still has problems, like the measurement of contact-holes, or the assurance of the measurement accuracy which corresponds to the expected patterns' dimension. On the other hand, more than 2/3 of respondents have replied that they would like to standardize the measurement method itself in order to transfer process technologies from R&D to the mass production lines, or to make more flexible production lines, and about 85% of them have replied concerning the necessity of measuring finer pattern dimension absolutely to keep a common scale.

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Toshio Kaneko and Yoshihiro Todokoro "Survey on pattern dimension measurement", Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); https://doi.org/10.1117/12.148956

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KEYWORDS

Semiconducting wafers

Photomasks

Wafer-level optics

Calibration

Metrology

Standards development

Humidity

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