8 August 1993 Cost/benefit analysis of mix-and-match lithography for production of half-micron devices
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Abstract
This paper describes a high-leverage cost-reduction methodology -- advanced mix-and-match lithography. Quantifying the areas of cost savings and cost of ownership is essential in determining the optimum mix-and-match approach. Cost of ownership, using operating data coupled with quantitative models, is analyzed for a half-micron 200 mm fabrication line producing 16 Mbit DRAMs. Utilizing advanced lithography clusters to process the critical levels and cost-effective high-productivity cluster systems for the non-critical levels has resulted in a net production cost savings in excess of 30%. Data comparisons are made between process enhancements and tool types. Areas of cost savings are identified individually and ranked. Further, tradeoffs in learning, cycle time, and technology extendibility are also considered. The cost/benefit analysis demonstrates that mix-and-match lithography is a highly effective method for reducing lithography costs. This paper also discusses the increasing importance of cost modeling to improve competitiveness.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John G. Maltabes, John G. Maltabes, Mark C. Hakey, Mark C. Hakey, Alan L. Levine, Alan L. Levine, } "Cost/benefit analysis of mix-and-match lithography for production of half-micron devices", Proc. SPIE 1927, Optical/Laser Microlithography, (8 August 1993); doi: 10.1117/12.150478; https://doi.org/10.1117/12.150478
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